MITSUBISHI ELECTRIC CORPORATION - Providing crucial energy-saving devices
as a global top-level power devices manufacturer -
Nov. 22, 2017
Toru Sanada Executive Officer
In charge of Semiconductor & Device
© Mitsubishi Electric Corporation
Contents
Introduction
Positioning and Features of Business
Business Environment
Growth Targets
Differentiation Strategy
Business Strategy by Segment
Manufacturing Strategy
Summary
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© Mitsubishi Electric Corporation
Introduction
Introduction
Embodiment of the Power device Business Mission
Corporate Mission
The Mitsubishi Electric Group will continually improve its technologies and services by applying creativity to all aspects of its business.
By doing so, we enhance the quality of life in our society.
【Contemporary Social Issues】
Environmental issues Resource/ Energy issues
【Initiatives of Mitsubishi Electric Group】
Global Development of Products, Systems, and Services
Make Strong Businesses Stronger
Technology Synergies/ Business Synergies
Realize
a Sustainable Society
Provide
Safety, Security, and Comfort
【Embodiment of the Corporate Mission in the Context of the Current Environment】
Growth Targets to be Achieved by FY2022
Net Sales 200 billion yen OPM 10%
"Global, Leading Green Company"
Contribute to the realization of a prosperous society
3
© Mitsubishi Electric Corporation
Positioning and Features of Business
Semiconductor devices that efficiently control electric power by converting electricity from DC to AC, DC to AC, or by raising or lowering voltage
Key energy saving devices used in a wide range of sectors including power control for industrial machinery, traction, electric vehicles (EV*), home
Positioning and Features of Business
Focused on Four Segments : Meeting Diverse Needs
Application segment
Application examples
IGBT module Case type
General HV1
IPM
Case type DIPtype
Discrete
Home appliances
Air conditioners
Washing
Fan motors
machinesRefrigerators
Inverters
Industry (Incl. renewable energy)
AC motors Photovoltaic power
generation
Robots
Traction/ Electric power
Traction
Power conditioner
Wind power generation
DC power transmission
Automotive
EV・HEV2
1 HV: High voltage 2 HEV: Hybrid electric vehicle
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© Mitsubishi Electric Corporation
Business Environment
Annual market growth rate of about 6%
(US$ million)
Global market scale by IGBT module segment (Mitsubishi Electric estimate)
Traction /Electric power
Industry
(incl. renewable energy)
Automobile
Home appliances
FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022
Background of power devices market expansion
Home appliances: Growth due to expansion of market for major appliances (air conditioners, refrigerators, washing machines, etc.) and progress in shift to inverters
Automotive: High growth due to accelerated shift to EVs due to more stringent environmental regulations
Industry: Expansion, mainly in FA market, due to investment in factory automation, power efficiency improvements, and
(incl. renewable energy)
strengthened environmental regulations for motors (incl. renewable energy). Growth will accompany expansion of renewable energy (solar and wind) markets around the world.
Traction/Electric power : Moderate growth in electric railway rolling stock market in line with population growth, urbanization, etc.
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© Mitsubishi Electric Corporation
Growth Targets
FY2022: Net sales of 200 billion yen and OPM of 10%
Power devices business
(100 million yen])
sales targets
130 billion yen
200 billion yen
Traction/Electric power Industry
(incl. renewable energy)
Automotive
Home appliances
FY2016 FY2017 FY2022
Growth strategy : 10% growth in focus segments (exceed market growth of 6%)
Home appliances: Enhance product lineup balanced with market demands (higher functionality, lower power loss, and lower costs), aiming to become the undisputed market leader
Automotive: Capture opportunities in the shift to electric-power automobiles and grow strongly worldwide Industry: Introduce competitive products to increase share in major markets for power device business
(incl. renewable energy)
Traction/Electric power : Pursue greater added value in infrastructure segment where growth is not high but demands for quality and reliability are high, to maintain the position as a top supplier
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© Mitsubishi Electric Corporation
Differentiation Strategy
Smaller packages
Less peripheral circuits
Lower losses for energy savings
Easy installation
Industry-standard package
Incorporation of peripheral functions
Power capacity
SiC
SiC
EV, etc.
Miniaturization
Increased capacity
Next generation
Automotive
Miniaturization & High power density
Incorporation of cooling functions
Operation in high-temp environments
Si*
* Si： Silicon
Carrier frequency
SiC
Switching power source, etc.
High
Integrated water cooler
New structures
Package development
Miniaturization
Traction / Electric power
Large current
High reliability
Industry-standard packages
Chip development
High performance
Si: Balance performance and cost
Low power loss
Wide application range
High reliability
SiC: High performance for value- added applications
Lower power loss (70% less than Si)
High-frequency switching (100kHz class)
High temp. operation (200 ºC class)
High-current-density packages
High-heat-dissipation substrates
Longer life
Low-stress structure at heat cycle
Low-thermal-resistance materials (bonding materials & encapsulants)
Higher functionality
Integrated radiators
Incorporation of peripheral circuits 12
Differentiation Strategy: Si IGBT chips
Evolution of Si IGBT chips
IGBT chip (1200V industrial use)
6th generation 7th generation Next generation
3rd gen.
Optimization of structure
Make ultra-thin (Ultra-thin device (higher performance
& easier to use)
Switching loss
4th gen.
5th gen.
6th gen.
7th gen.
Next gen.
Electrification loss
Combine IGBT and diode onto
one chip to improve manufacturability and module power density
(Merge functions)
Make ultra-thin (Ultra-thin device
RC-IGBT*
(higher performance
Next-
& easier to use)
generation RC-IGBT
* RC-IGBT： Reverse conducting-IGBT
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© Mitsubishi Electric Corporation
5. Differentiation Strategy: SiC
Become No.1 in many SiC applications1
Pursue advanced achievements through synergy among strong power electronics business units within company
Introduce SiC power modules from the start, applying SiC to product groups for all applications
Equipped for first time in the world
Commercialized SiC inverter for use in railcars
(October 2011)
Traction
Equipped for first time in the world
Installs Railcar Traction System with All-SiC Power Modules on Shinkansen Bullet Trains
Equipped for first time in the world
Industry
gy
Automotive
Launched Computer numerical control (CNC) drive unit equipped
Equipped for first time in the world
Under Development
Develops SiC for application in elevator control systems
(Announced in February 2013)
(Announced in June 2015)
with SiC power module
(Released in December 2012)
World smallest
Under Development
Industry best
Ener
Develops world's smallest SiC Inverter for HEVs (Announced in March 2017)
Industry
Home Appliances
Equipped for first time in industry
Verified highest power conversion efficiency for photovoltaic power conditioner (domestic industry) (Announced in January 2011)
best
Launched power conditioner for photovoltaic equipped with full SiC-IPM
(Released in January 2015)
Equipped for first time in the world
Launched "Kirigamine" inverter air conditioner (Released in October 2010)
Launched package air conditioners with full SiC DIPIPM2 in Japan (Released in May 2016)
Development of these modules and applications has been partially supported by Japan's Ministry of Economy Trade and Industry (METI) and New Energy and Industrial Technology Development Organization (NEDO).
1 The year and month listed are based on press releases or information released during the product launch month in Japan. 2 DIPIPM: Registered trademark of Mitsubishi Electric Corporation
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© Mitsubishi Electric Corporation
Differentiation Strategy: SiC chips
Continuous development of SiC to lower costs and improve performance
Features of SiC chips
Item Si SiC Customer benefits Combined uses
Power loss 1 1/3 High efficiency, higher output and
energy savings
EVs, air conditioner, railways, and DC power transmission
High temp. operation 175℃ Tj>200℃ Reduced heat-dissipation fins EVs and special inverters
High-speed switch 30KHz Fc>100KHz High efficiency and smaller size Power sources andnon-contact
power supply
Advancement of SiC chips
Trench MOSFET ⇒Smaller size/Low loss/High
reliability
Gate placed on wall of trench formed downward and cell density improved/refined with aim of
MOSFET structure comparison
Source electrode
Source electrode
Gate electrode
n-type source
Gate electrode
Trench
p-type well
n-type drift layer
lowest loss in the industry
Original field alleviating structure employed to
n-type drift layer
n-type SiC substrate
Trench electrode
n-type SiC substrate
Trench electrode
improve reliability
MOSFET with built-in SBD* ⇒Smaller size/Low cost
Mitsubishi Electric original technology where chip is miniaturized by building SBD in to MOS Effective especially for high-voltage devices and has approx. 60% surface area for 3.3kV
Flat MOSFET Trench MOSFET
MOSFET with built-in SBD
Chip surface area reduction by building in SBD (image)
Forward-looking R&D is pursuing new-material power devices, such as vertical GaN and gallium oxide,
in addition to SiC-IGBT (current MOSFET)
SBD： Schottky barrier diode
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© Mitsubishi Electric Corporation
Business Strategy by Segment : Home appliances
© Mitsubishi Electric Corporation
Growth strategy
Enhance product lineup balanced with market demands (higher functionality, lower power loss, and lower costs) with the goal of being the undisputed market leader
DIPIPM utilizing transfer mold technology
High-quality and diverse product lineup
Capture more share where inverter use is expected to grow:
Washing machines
(2017: 19% 2022: 62%)
Refrigerators
(2017: 18% 2022: 40%)
Our strengths
and features
World's top production
Lower costs
Enter small-capacity fan-motor market
Lower costs
Application technology and
customer support capability for top share in segment
capacity and stable supply support capabilities
For existing RAC/PAC*, gradually develop new markets in developing economies where switch to inverters is progressing
( roughly double from 2017 to 2022)
Lower costs
Introduce SiC products in luxury device market
Energy savings and higher functionality
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*RAC： Room air conditioner, PAC: Package air conditioner © Mitsubishi Electric Corporation
6. Business Strategy by Segment: Home appliances
Product strategy
Higher functionality: More products equipped with SiC and reduce loss
Lower costs: Apply RC-IGBT chips and low-cost packages
High
Luxury room air conditioners
price
Full SiC DIPIPM
Hybrid
Pursue energy saving
While balancing costs , enhance product lineup to
SiC DIPIPM
SJMOS1 equipped ultracompact DIPIPM
Mainstream room air conditioners
Ultracompact DIPIPM
become dominant leader
Pursue lower costs
Strategic products
RC-IGBT equipped SLIMDIP2
Washing machines & Refrigerators
Low price
RC-IGBT equipped Small-capacity IPM
Small volume (luxury products) High volume (mainstream products)
© Mitsubishi Electric Corporation
1 SJMOS: Super Junction MOSFET 2 SLIMDIP: Registered trademark of Mitsubishi Electric Corporation 17
6. Business Strategy by Segment: Automotive
Ability to offer diverse solutions according to customer demands (chips & modules)
Our strengths and features
High quality, strong
© Mitsubishi Electric Corporation
Growth strategy
Capture opportunities in shift to electric- power automobiles and grow strongly worldwide
Shift focus from Japan to overseas markets
Shift development and delivery from customized to standardized products
Deploy standardized modules (J/J1 series) globally
technical application Support, and customer- support abilities
Abundant know-how and goodmarket
performance from start of EV market
11 million
Raise chip performance
Si: Raise IGBT and RC-IGBT
Cumulative xEV* equipped with our power devices
units
performance
SiC： Shift to 6-inch and trench type
© Mitsubishi Electric Corporation
* xEV: General term for electric vehicles 18
6. Business Strategy by Segment: Automotive
Standard module product strategy
Expand product lineup according to market demands (high voltage, large current)
High voltage
lineup
1200V
650V
Advantages of J1 series
Compact (footprint approx.
30% smaller than other makes)1
Light weight (approx. 30% lighter than other makes)1
High heat dissipation
High efficiency
J series (transfer mold)
For small-capacity (J series)
J1 series
For medium-capacity (J1A series)
Large current
For large- capacity (J1B series)
Further performance increase with SiC- equipped products
～
Motor
capacity [kW] 10 20 30 40 50 60 70 80 90 150
Target xEV models
ULV2
Mild Hybrid (except 48V)
PHEV3 BEV4 / FCEV5
Full Hybrid
1 As of November 2017: Mitsubishi Electric
2 Ultra-light vehicles 3 Plug-in hybrid electric vehicles 4 Electric vehicles 5 Fuel-cell electric vehicle
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© Mitsubishi Electric Corporation
6. Business Strategy by Segment: Industry, incl. Renewable Energy
Know-how accumulated serving Japanese users over many decades
and market performance
Our strengths and features
Products offering
© Mitsubishi Electric Corporation
Growth strategy
Increase share in major markets for power devices business with competitive products
Focus on business in European and Chinese markets while maintaining high market share in Japan
Focus on energy storage, charging, and EV buses as new markets
Increased strategic original packages in addition to industrial-standard
competitive
advantages based on 7th generation chips and new package technologies
High quality, strong
technical application support and customer support abilities
packages
Increased intelligent products (for IoT*)
Develop products and synergies with Vincotech (German)
* IoT： Internet of Things 20
© Mitsubishi Electric Corporation
Product strategy
Business Strategy by Segment : Industry , incl. Renewable Energy
Medium- and large-capacity products: Enhance industry-standard packages and increase capacities
Small-capacity products: Enhance lineup of DIPIPM original packages (No.1 among home appliances ) and pursue lower costs and higher quality
Transfer medium- and large-capacity technologies to Vincotech to capture custom products market
Current capacity
Oriented to custom products
(Small scale)
(Large)
Vincotech & Mitsubishi Electric joint modules
(new products)
Vincotech modules
Mitsubishi Electric IGBT modules and IPM (industry-standard packages)
Mitsubishi Electric original packages (DIPIPM for industry)
Future lineup enhancement (Products under development, etc.)
Existing lineup (Mass produced products)Oriented to general purpose products
(Large scale)
(Small)
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© Mitsubishi Electric Corporation
6. Business Strategy by Segment: Traction and Electric power
High reliability for infrastructure
Our strengths and features
A1-22
© Mitsubishi Electric Corporation
Growth strategy
Pursue greater added value in infrastructure segment, where growth is not high but high quality/reliability are demanded, to maintain position as a top supplier
Deploy products that utilize latest Si technologies (X series: equipped with first 7th generation 8-inch chips and employs latest packaging technology)
Deploy high-voltage, low-loss SiC module products (3.3kV and 1.7kV)
Unmatched record and know-how in high- voltage segment
Top record* in mass production of high-voltage SiC module products
Continue to develop Chinese and Indian markets, where solid demand is expected for railways.
Focus on DC power transmission, where future expansion is anticipated in Europe, North America and China
* As of November 2017, surveyed by Mitsubishi Electric
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© Mitsubishi Electric Corporation
Business Strategy by Segment: Traction/Electric power
Product strategy
Expand applications in traction and electric-power market by introducing products with current densities exceeding those of other makes
Production Strategy : Wafer Production
Maintain highly added-value processes that are key to differentiation at company factories and continue to make investments (Si wafer back side processing and SiC wafers)
Maximize production subcontracting (fabrication outsourcing) for Si wafer surface processing involving mainly general technologies and expand capacity while minimizing investments
Utilize IoT and promote thorough productivity improvements
Promote transition to multiple production lines to fortify BCP*
Surface processing
Kumamoto (Koshi City): Mother factory Wafer-surface and back-side processing (including SiC)
Hyogo (Itami City) Si-wafer back-side processing
Wafer processBack side processing*
*Process specific to power wafers where electrodes, etc. are formed after grinding back side of wafer
Fukuoka (Fukuoka City): SiC wafer (4-inch) surface and back- side processing
Japan production outsourcing
Si-wafer surface processing
Overseas production outsourcing
(to be decided) Si-wafer surface processing
* BCP： Business continuity plan
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© Mitsubishi Electric Corporation
Production Strategy (assembly/inspection)
Establish global system based on local production and consumption
Utilize IoT for thorough productivity improvements
Transition to multiple production lines to fortify BCP
Internalize inspection technologies as know-how and advance them
Summary
Embodiment of the Corporate Mission
Corporate Mission
The Mitsubishi Electric Group will continually improve its technologies and services by applying creativity to all aspects of its business.
By doing so, we enhance the quality of life in our society.
【Contemporary Social Issues】
Environmental issues Resource/ Energy issues
【Initiatives of Mitsubishi Electric Group】
Global Development of Products, Systems, and Services
Make Strong Businesses Stronger
Technology Synergies/ Business Synergies
Realize
a Sustainable Society
Provide
Safety, Security, and Comfort
【Embodiment of the Corporate Mission in the Context of the Current Environment】
Growth Targets to be Achieved by FY2020
Net Sales 5 trillion yen or more OPM 8% or more
"Global, Leading Green Company"
Contribute to the realization of a prosperous society
2
© Mitsubishi Electric Corporation
Power devices are crucial for low-carbon societies
appliances, photovoltaic power generation, wind power generation, motor control, and more.
Motor driving inverter Photovoltaic power generation power conditioner
Voltage
Voltage
DCAC
Voltage
Voltage
DCAC
Time
Battery
Power electronics device
Time
Motor
Time
Solar cell
Power electronics device
Time
Air conditioner & home appliance
Power Devices
* EV： Electric Vehicle 4
© Mitsubishi Electric Corporation
2. Positioning and Features of Business
Positioned as a business that to drive corporate growth
Energy & Electric Systems
Power Systems
Power generation systems, Transmission & distribution systems, Power distribution systems,
Particle therapy systems, etc. Transportation Systems Inverters, main motors and
air conditioning systems for railcars, Train Vision, Train control and management systems,
Railcar operation management systems, Signaling systems, etc.
Building Systems
Elevators, Escalators,
Building management systems, etc.
Public Systems
Water treatment systems, Disaster prevention systems, etc.
Industrial Automation Systems
Factory Automation (FA) Systems
PLCs, AC servomotors,
CNCs, Industrial robots,
Laser processing machines, etc. Automotive Equipment Starters, Alternators, Car multimedia, EPS system products,
Electric powertrain system, etc.
1 SiC：Silicon carbide 2 IGBT：Insulated gate bipolar transistor 3 GaN：Gallium nitride
Information & Communication Systems
Space Systems
Satellites, Ground systems for satellite control, etc.
Defense Systems
Radar equipment, Antennas, etc. Communication Systems Optical, wireless and satellite communications systems, etc.
Video Monitoring Systems
Network camera systems
IT Solution
Electronic Devices
Power Devices
SiC1 modules, IGBT2 modules, etc.
High Frequency and Optical Devices
High frequency devices (GaN3
and GaAs4), Optical devices, etc.
TFT5 LCD Modules
Home Appliances
Air-Conditioning & Refrigeration Systems
Room and package air conditioners,
Multiple AC units for buildings, Lossnay ventilation systems, Chillers, etc.
Housing Equipment
Smart appliances, Lighting, HEMS, etc.
Kitchen and Other Household
4 GaAs：Gallium arsenide 5 TFT：Thin film transistor
Appliances
5
© Mitsubishi Electric Corporation
2. Positioning and Features of Business
Strengths are in-house business and technology synergies, and global innovation
Mitsubishi Electric
Industrial Automation Systems
Energy & Electric Systems Home Appliances
Business segments
Technology/business synergies (make strong businesses even stronger)
Electronic devices (power devices)
Advanced Technology R&D Center
Information Technology R&D Center
Open & global innovation
Government & foundations
(national projects)
Standardizing body forums, etc.
Universities
Companies
Research-related independent administrative agencies
(AIST, etc.)
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© Mitsubishi Electric Corporation
2. Positioning and Features of Business
Our Focus : IGBTs and Modules
IGBT and MOSFET*
Discrete
100M
Device output capacity [VA]
10 M
Application range for power devices
IGBT
Diode
1M
100k
10 k
IGBT
IGBT module
1k
100
1k
MOSFET
10 k 100 k 1 M
Compound power devices with multiple IGBTs and diodes in a
Switching frequency [Hz]
single package
* MOSFET：Metal oxide semiconductor field effect transistor
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© Mitsubishi Electric Corporation
2. Positioning and Features of Business
Focus on maintaining world's top share1 in IPM2
Drive circuit
Control IC
IGBT module
Package Case type
Short-circuit- monitoring Protection circuit
Control IC
IPM
Package Case type
Drive circuit
Short-circuit- monitoring Protection circuit
DIP type
(Dual In-line Package)
1 As of November 2017, surveyed by Mitsubishi Electric 2 IPM: Intelligent power module
8
© Mitsubishi Electric Corporation
Developing high-efficiency power devices (chip)s and packages that match market needs are inseparable for differentiation.
Low cost
Home appliances Industry / Renewable energy
Large
Traction/DC power transmission
© Mitsubishi Electric Corporation
Current density [A/cm2]
SiC-equipped products
12
X series
(LV100 and HV100 package)
9
Railway
Traction
6
R series
Electric powerX series (Standard package)
H series
3
FY2017 FY2022
23
© Mitsubishi Electric Corporation
Fukuoka (Fukuoka City/Itoshima City): Mother factory
Automotive/Traction/ Home appliances products
Hyogo (Itami City/Toyooka City) Industrial products
China (Hefei City/Shanghai City*) Home appliances products
*Outsourcing in Shanghai
Hungary (Vincotech) Industrial products
Assembly/inspection processes25
© Mitsubishi Electric Corporation
[100
millio n
© Mitsubishi Electric Corporation
Growth target for "FY2022" Net Sales 200 billion yen OPM 10%
Overseas sales ratio 60%
Growth target for "FY2022" Net Sales 200 billion yen OPM 10%
Overseas sales ratio 60%
200 billion yenTraction/Electric power
130 billion yen
Industry
(incl. renewable energy)
Automotive
Home appliance
FY2017
FY2022
26
© Mitsubishi Electric Corporation
MITSUBISHI ELECTRIC
Changes f or the Better
Mitsubishi Electric Corporation published this content on 22 November 2017 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 22 November 2017 02:09:03 UTC.
Original documenthttp://www.mitsubishielectric.com/news/2017/1122.pdf
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